Термо паста Thermaltake TG-30 4G

Предназначен за: Охлаждащи системи
Х-ка 2: TG-30 is a premium thermal compound for high standard cooling performance designed to lower CPU temperatures effectively.
Х-ка 3: The thermal compound contains diamond powder, which would provide a thermal conductivity of 4.5 W/m-k that could fulfill the user’s primary needs.
Х-ка 4: Density: 2.55 g/cm3
Х-ка 5: Viscosity: 76 Pa-s
Х-ка 6: Thermal impedance: 0.185°C -in2/W
Х-ка 7: Thermaltake’s specially formulated thermal compound fits perfectly with the honeycomb stencil, which provides an easier way to apply your thermal compound for a neat and well-covered surface that fits all CPUs.
Х-ка 8: The high-quality thermal compound provides a longer lifespan of eliminating dry-out or cracking while in use. Non-electrical conductive compound ensures better safety measures for you and your system.